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Dive into the research topics where Yohei Yagishita is active.

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Featured researches published by Yohei Yagishita.


international symposium on radio-frequency integration technology | 2015

A 76–81 GHz high efficiency power amplifier for phased array automotive radar applications

Ikuo Soga; Yohei Yagishita; Hiroshi Matsumura; Yoichi Kawano; Toshihide Suzuki; Taisuke Iwai

This paper describes the implementation of 76-81 GHz power amplifier (PA) in 65 nm CMOS technology. A customized transistor model enables the designing circuits operating at mm-wave band. The output matching of the PA was composed of low-pass network to reduce both footprint and matching loss. This makes the PA ideal for phased array radars. The measured results at 79 GHz achieved the small signal gain of 25.1 dB, the saturated output power (Psat) of 11.5 dBm, and the power added efficiency (PAE) of 13.6% at the supply voltage of 0.8 V. These results agreed with the simulation.


asia pacific microwave conference | 2015

265-GHz, 10-dB gain amplifier in 65-nm CMOS using on-wafer TRL calibration

Yohei Yagishita; Yoichi Kawano; Hiroshi Matsumura; Ikuo Soga; Toshihide Suzuki; Taisuke Iwai

In this paper, a 65-nm CMOS amplifier MMIC operating around 265 GHz is presented. To obtain a small signal gain of the amplifier in a frequency region close to Fmax (Maximum oscillation frequency) of a transistor, a neutralization technique of a feedback capacitance as well as a transistor model to neutralize it precisely are needed. For this purpose, the key is a de-embedding technique. To extract the intrinsic transistor characteristics from a test pattern for measurement, we employ an on-wafer TRL (Through-Reflect-Line) calibration method. In this method, the calibration patterns including Through, Reflect, and Line are fabricated on the same wafer with the transistor for modeling. With the help of the precise model based on on-wafer TRL, we can successfully obtain a gain of 10dB around 265 GHz, and an excellent agreement with simulation and measurement results.


Archive | 2012

Electronic component and method of manufacturing electronic component

Shinichi Hirose; Taisuke Iwai; Yoshitaka Yamaguchi; Yohei Yagishita; Yukie Sakita; Masaaki Norimatsu


Archive | 2009

Heat radiation material, electronic device and method of manufacturing electronic device

Yoshitaka Yamaguchi; Taisuke Iwai; Shinichi Hirose; Daiyu Kondo; Ikuo Soga; Yohei Yagishita; Yukie Sakita


Archive | 2012

SHEET-SHAPED STRUCTURE, METHOD FOR MANUFACTURING SHEET-SHAPED STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Yoshitaka Yamaguchi; Taisuke Iwai; Masaaki Norimatsu; Shinichi Hirose; Yohei Yagishita; Yukie Sakita


Archive | 2010

Heat dissipating structure and production method therefor

Taisuke Iwai; 岩井大介; Daiyu Kondo; 近藤大雄; Yoshitaka Yamaguchi; 山口佳孝; Shinichi Hirose; 廣瀬真一; Yukie Sakita; 崎田幸恵; Yohei Yagishita; 八木下洋平; Masaaki Norimatsu; 乘松正明


Archive | 2009

Sheet type member and electronic apparatus

Shinichi Hirose; Daisuke Iwai; Daiyu Kondo; Yukie Sakida; Ikuo Soga; Yohei Yagishita; Yoshitaka Yamaguchi; 洋平 八木下; 佳孝 山口; 大介 岩井; 幸恵 崎田; 真一 廣瀬; 育生 曽我; 大雄 近藤


Archive | 2011

Heat-dissipating material and method for producing same, and electronic device and method for producing same

Yoshitaka Yamaguchi; Taisuke Iwai; Masaaki Norimatsu; Yukie Sakita; Shinichi Hirose; Yohei Yagishita


Archive | 2011

SHEET-LIKE STRUCTURE, MANUFACTURING METHOD THEREOF, ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD THEREOF

Yoshitaka Yamaguchi; Daisuke Iwai; Masaaki Norimatsu; Shinichi Hirose; Yohei Yagishita; Yukie Sakida; 正明 乘松; 洋平 八木下; 佳孝 山口; 大介 岩井; 幸恵 崎田; 真一 廣瀬


Archive | 2000

Heat radiating material and method for manufacturing the same

真一 ▲廣▼瀬; Shinichi Hirose; Daisuke Iwai; 大介 岩井; Seiki Sakuyama; 誠樹 作山; Yoshihiro Mizuno; 義博 水野; Takaharu Asano; 高治 浅野; Masaaki Norimatsu; 正明 乘松; Yukie Sakida; 幸恵 崎田; Yohei Yagishita; 洋平 八木下; Yoshitaka Yamaguchi; 佳孝 山口

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