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Yu-feng Chen

TSMC

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Publication

Featured researches published by Yu-feng Chen.

Archive | 2012

Methods and Apparatus for Package with Interposers

Kai-Chiang Wu; Hsien-Wei Chen; Yu-feng Chen; Chun-Hung Lin; Ming-Kai Liu; Chun-Lin Lu

Archive | 2012

Crack stopper on under-bump metallization layer

Yu-feng Chen; Chun-Hung Lin; Han-Ping Pu; Chih-Hang Tung; Kai-Chiang Wu; Ming-Che Ho

Archive | 2012

Stress Compensation Layer for 3D Packaging

Chun-Hung Lin; Yu-feng Chen; Han-Ping Pu; Hung-Jui Kuo

Archive | 2012

MECHANISMS OF FORMING CONNECTORS FOR PACKAGE ON PACKAGE

Yu-feng Chen; Chun-Hung Lin; Han-Ping Pu; Ming-Da Cheng; Kai-Chiang Wu

Archive | 2014

Bumps for Chip Scale Packaging

Chun-Hung Lin; Yu-feng Chen; Tsung-Shu Lin; Han-Ping Pu; Hsien-Wei Chen

Archive | 2015

Zero Stand-Off Bonding System and Method

Chun-Hung Lin; Ming-Che Ho; Yu-feng Chen; Yi-Wen Wu; Hsien-Liang Meng; Han-Ping Pu

Archive | 2011

Wafer Level Chip Scale Package with Reduced Stress on Solder Balls

Yu-feng Chen; Yu-Ling Tsai; Han-Ping Pu; Hung-Jui Kuo; Yu Yi Huang

Archive | 2013

Packages with Molding Material Forming Steps

Yu-Chen Hsu; Chun-Hung Lin; Yu-feng Chen; Han-Ping Pu

Archive | 2017

Bumps for chip scale packaging including under bump metal structures with different diameters

Chun-Hung Lin; Yu-feng Chen; Tsung-Shu Lin; Han-Ping Pu; Hsien-Wei Chen

Archive | 2016

Pre-Applying Supporting Materials between Bonded Package Components

Yu-Chen Hsu; Yu-feng Chen; Han-Ping Pu; Meng-Tse Chen; Guan-Yu Chen

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Collaboration

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Han-Ping Pu

TSMC

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Chun-Hung Lin

TSMC

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Kai-Chiang Wu

TSMC

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Hsien-Wei Chen

TSMC

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Ming-Che Ho

TSMC

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Chih-Hang Tung

TSMC

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Hung-Jui Kuo

TSMC

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Tsung-Shu Lin

TSMC

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Yu-Chen Hsu

TSMC

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Chun-Lin Lu

TSMC

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