Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Charles M. Watkins is active.

Publication


Featured researches published by Charles M. Watkins.


Revue internationale d'ingénierie des systèmes de production mécanique | 2002

Field emission display

David A. Cathey; Charles M. Watkins


Archive | 2010

Through-wafer interconnects for photoimager and memory wafers

Salman Akram; Charles M. Watkins; Mark Hiatt; David R. Hembree; James M. Wark; Warren M. Farnworth; Mark E. Tuttle; Sidney B. Rigg; Steven D. Oliver; Kyle K. Kirby; Alan G. Wood; Lu Velicky


Archive | 2004

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Salman Akram; Charles M. Watkins; Kyle K. Kirby; Alan G. Wood; William M. Hiatt


Archive | 2006

Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Sidney B. Rigg; Charles M. Watkins; Kyle K. Kirby; Peter A. Benson; Salman Akram


Archive | 2004

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Charles M. Watkins; David R. Hembree; Peter A. Benson; Salman Akram


Archive | 2003

Semiconductor component having encapsulated, bonded, interconnect contacts

William M. Hiatt; Warren M. Farnworth; Charles M. Watkins; Nishant Sinha


Archive | 2004

Microelectronic imagers and methods of packaging microelectronic imagers

Warren M. Farnworth; Sidney B. Rigg; William M. Hiatt; Kyle K. Kirby; Peter A. Benson; James M. Wark; Alan G. Wood; David R. Hembree; Salman Akram; Charles M. Watkins


Archive | 2005

Microfeature workpieces, carriers, and associated methods

William M. Hiatt; Charles M. Watkins


Archive | 2002

Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts

William M. Hiatt; Warren M. Farnworth; Charles M. Watkins; Nishant Sinha


Archive | 2003

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Sidney B. Rigg; Charles M. Watkins; Kyle K. Kirby; Peter A. Benson; Salman Akram

Collaboration


Dive into the Charles M. Watkins's collaboration.

Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Top Co-Authors

Avatar
Researchain Logo
Decentralizing Knowledge