William M. Hiatt

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Pass through via technology for use during the manufacture of a semiconductor device

Microelectronic devices and methods for forming interconnects in microelectronic devices

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Microelectronic devices and methods for filling vias in microelectronic devices

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Microfeature workpieces and methods for forming interconnects in microfeature workpieces

Backside method and system for fabricating semiconductor components with conductive interconnects

Semiconductor component having plate, stacked dice and conductive vias