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Kyle K. Kirby

Micron Technology

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Publication

Featured researches published by Kyle K. Kirby.

Archive | 2003

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Warren M. Farnworth; Alan G. Wood; William M. Hiatt; James M. Wark; David R. Hembree; Kyle K. Kirby; Pete A. Benson

Archive | 2010

Through-wafer interconnects for photoimager and memory wafers

Salman Akram; Charles M. Watkins; Mark Hiatt; David R. Hembree; James M. Wark; Warren M. Farnworth; Mark E. Tuttle; Sidney B. Rigg; Steven D. Oliver; Kyle K. Kirby; Alan G. Wood; Lu Velicky

Archive | 2004

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Salman Akram; Charles M. Watkins; Kyle K. Kirby; Alan G. Wood; William M. Hiatt

Archive | 2004

Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages

Alan G. Wood; Kyle K. Kirby; Warren M. Farnworth; Salman Akram

Archive | 2008

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

Kyle K. Kirby

Archive | 2008

Microelectronic devices and methods for forming interconnects in microelectronic devices

Kyle K. Kirby; Salman Akram; David R. Hembree; Sidney B. Rigg; Warren M. Farnworth; William M. Hiatt

Archive | 2006

Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Sidney B. Rigg; Charles M. Watkins; Kyle K. Kirby; Peter A. Benson; Salman Akram

Archive | 2003

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Warren M. Farnworth; Alan G. Wood; William M. Hiatt; James M. Wark; David R. Hembree; Kyle K. Kirby; Pete A. Benson

Archive | 2003

Microelectronic devices and methods for filling vias in microelectronic devices

William M. Hiatt; Kyle K. Kirby

Archive | 2006

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Warren M. Farnworth; Alan G. Wood; William M. Hiatt; James M. Wark; David R. Hembree; Kyle K. Kirby; Pete A. Benson

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Collaboration

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Warren M. Farnworth

Micron Technology

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William M. Hiatt

Micron Technology

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Alan G. Wood

Micron Technology

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Salman Akram

Micron Technology

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David R. Hembree

Micron Technology

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Charles M. Watkins

Micron Technology

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James M. Wark

Micron Technology

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Sidney B. Rigg

Micron Technology

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Steve Oliver

Micron Technology

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Peter A. Benson

Micron Technology

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