Kyle K. Kirby

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Through-wafer interconnects for photoimager and memory wafers

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

Microelectronic devices and methods for forming interconnects in microelectronic devices

Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Microelectronic devices and methods for filling vias in microelectronic devices

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts