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IEEE Transactions on Electron Devices | 1991

Graded-junction gate/n/sup -/ overlapped LDD MOSFET structures for high hot-carrier reliability

Yoshinori Okumura; Tatsuya Kunikiyo; Ikuo Ogoh; Hideki Genjo; Masahide Inuishi; Masao Nagatomo; Takayuki Matsukawa

A newly developed gate/n/sup -/ overlapped LDD MOSFET was investigated. The MOSFET was fabricated by an oblique rotating ion implantation technique. A formula for the impurity ion profile was derived to analyze the lowering of substrate current and improvement of the degradation caused by the hot-carrier effect of the MOSFET. It was proved that the impurity ion profile near the drain edge is remarkably graded in the directions along channel and toward substrate even just after the implantation, so that the maximum lateral electric field is relaxed as compared with conventional LDD MOSFETs. Also, the maximum point of the lateral electric field at the drain edge is located apart from the main path of the channel current. >


IEEE Journal of Solid-state Circuits | 1990

Improved address buffers, TTL input current reduction, and hidden refresh test mode in a 4-Mb DRAM

Hiroshi Miyamoto; Tadato Yamagata; Shigeru Mori; Tetsuya Aono; Ikuo Ogoh; Michihiro Yamada

Improved circuits for a 4-Mb CMOS DRAM are described. In one of them, called the effective one-shot gate address buffer, the input address is provided to the gate of a transistor, and a gating transistor located between the input node of the buffer and the transistor is controlled by an equivalent one-shot pulse with sufficient high level. This reduces the row address hold time and also RAS-bar access time. A standby current limitation circuit eliminates the standby current at the input stage of the buffer even with TTL-level input voltage. Test-mode hidden refresh is achieved without test-mode resetting, which enhances the testability and relaxes the test sequence. The RAM employs a 0.8- mu m twin-well CMOS process technology and a stacked capacitor with a storage capacitance of 35 fF. A 58-ns RAS-bar access time and a 65-mA active current at 160-ns cycle are achieved in a die size of a 6.84 mm*14.95 mm. The RAM is housed in a 350-mil small-outline J-leaded package and a 400-mil zig-zag in-line package. >


international symposium on vlsi technology, systems, and applications | 1989

A 58 ns 4 Mb CMOS DRAM with an effective one-shot gate address buffer

Hiroshi Miyamoto; Tadato Yamagata; Shigeru Mori; Ikuo Ogoh; M. Nagatomo; Michihiro Yamada

A 4-Mb CMOS dynamic RAM (DRAM) with an effective one-shot gate address buffer has been fabricated. The buffer greatly reduces row address hold time, which gives a fast RAS (row-address strobe) access time of 58 ns. The RAM also implements a novel standby current limitation circuit, which saves the current in the first stage of the buffer even with the TTL-level input voltage. The memory cell has a stacked capacitor. The RAM measures 6.84 mm*14.95 mm and is housed in a 350-mil small-outline J-leaded (SOJ) package and a 400-mil zig-zag in-line package (ZIP).<<ETX>>


Archive | 1990

Electrically programmable non-volatile memory device and manufacturing method thereof

Hideaki Arima; Yoshinori Okumura; Hideki Genjo; Ikuo Ogoh; Kohjiroh Yuzuriha; Yuichi Nakashima


Archive | 1995

Method of making asymmetric LDD transistor

Ikuo Ogoh


Archive | 1993

LDD CMOS with wider oxide sidewall on PMOS than NMOS

Ikuo Ogoh


Archive | 1989

SEMICONDUCTOR MEMORY DEVICE WITH IMPROVED STACKED CAPACITOR STRUCTURE

Wataru Wakamiya; Ikuo Ogoh


Archive | 1995

MOSFET with assymetric lightly doped source-drain regions

Ikuo Ogoh


Archive | 1993

DRAM device comprising a stacked type capacitor and a method of manufacturing thereof

Ikuo Ogoh; Masao Nagatomo


Archive | 1989

Semiconductor storage (memory) device and method of production thereof

Wataru Wakamiya; Ikuo Ogoh

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