Kuan-Yu Lu

A new type of CMOS inverter with Lubistor load and TFET driver for sub-20 nm technology generation

This paper presents a complementary Lubistor and TFET (CLTFET) inverter, which is composed of a lateral unidirectional bipolar-type insulated-gate transistor (Lubistor) load and a tunneling field effect transistor (TFET) driver. Based on the measurement data of Lubistor and TFET devices published, we have for the first time drawn the load lines and operation point line (Q line) of the new designed CLTFET compared with the conventional CTFET to verify its feasibility. The delay time is improved more than 29.5%. Additionally, due to its unique structure and the output node being shared by the load and the driver, the integration density of it can be reduced dramatically. The area benefit thus more than 32.6% has been achieved compared with the conventional CTFET layout.

Numerical study of performance comparison between junction and junctionless thin-film transistors

This paper for the first time presents a performance comparison between junction and junctionless thin-film transistors (TFTs) by using TCAD simulations. Note that the DIBL and S.S. of a junctionless TFT (JLTFT) are larger and higher, respectively, than those of its junction TFT (JTFT) counterpart. Although the JLTFT gets a higher current drive based on the same Vov as compared with the JTFT, its short-channel characteristics are worse and degraded. These results can be attributed to the fact that the major carriers in channel region for a JTFT make itself a barrier to carrier scattering, whereas, the JTFT does not have this problem, leading to get a high current drive. On the other hand, it may be owing to the grain boundary effects for a JLTFT to degrade its short-channel behavior. Fortunately, these results are still acceptable for scaled dimensions of TFTs.

A 3-D simulation study of a novel vertical MOSFET with source-tied (STVMOS)

In this paper, we propose a source-tied vertical MOSFET (STVMOS) by using 3-D simulation. The characteristics of STVMOS are not only similar to the SOI vertical MOSFET (SOI-VMOS), but also have much better thermal reliability. According to TCAD simulation results, we have achieved 70 mV/decade S.S., 145 mV/V DIBL, and more than 109 ION/IOFF current ratio.

A novel vertical MOSFET with bMPI structure for 1T-DRAM application

This paper proposes a novel vertical MOSFET with the middle partial insulation and block oxide (bMPI) structure for 1T-DRAM application. The bMPI 1T-DRAM can increase the pseudo-neutral region due to the bMPI under the vertical channel and its device sensing current window is improved about 95% when compared to the planer bMPI 1T-DRAM. Because of the double gate structure, the proposed device has great gate controllability; hence, it can reduce the short-channel effects and enhance the electrical characteristics.

Design theory and fabrication process of 90nm unipolar-CMOS

The innovative basic punchthrough theory for the unipolar-CMOS is for the first time presented and the first unipolar-CMOS inverter has been fabricated successfully by using the 90nm technology developed in Taiwan National Nano Device Lab. The severe scaling issues with silicon can be further use and no more serious. The low-performance P-FETs can be get rid of and switch much faster both for high-electron-mobility III–V and CNT based technology. According to the measurement two empirical models, the new concept of the load line drawing and the optimum design of the unipolar-CMOS are also illustrated. Employing them for unipolar-CMOS design, the desired high performance ultimate SOC and SOP system can be easily realized.

Characterization of a body-tied vertical MOSFET

In this paper, a non-classical body-tied vertical field-effect transistor (BTVFET) utilizing the self-aligned technique is presented and demonstrated. Based on the simulations, we find out that the electrical characteristics of the BTVFET are better than that of the conventional SOI VFET, including the outstanding ability of heat dissipation, higher channel mobility, lower parasitic capacitance, and reduced gate leakage current. The excellent subthreshold swing (~77 mV/dec) of the BTVFET is also attractive. In addition, the shallow junction is easy to form because the partially insulating oxide is under the drain regions in our proposed quasi-SOI vertical MOSFET. Hence, it is believed that the BTVFET can become one of the candidates for future CMOS scaling.

Thermal characteristics of an advanced bMPI-based 1T-DRAM cell

In this paper, we study the thermal characteristics of the bMPI-based 1T-DRAM cell. For a bMPI-FET, it can not only improve the thermal stability about 38% compared with the bPDSOI-FET due to the S/D-tied scheme, but also maintain the desired short-channel characteristics due to the block oxide structure.

Study of junctionless pseudo tri-gate vertical MOSFETs for RF/analog applications

In this study, junctionless technology employed for fabricating pseudo tri-gate vertical (PTGV) MOSFETs is proposed and the RF/analog performance is also investigated and demonstrated. According to simulation results, the excellent performances such as high transconductance (gm), high cut-off frequency (ƒT), and high transconductance generation factor (gm/Id) are achieved. The numerical results also provide a prediction of an 8nm gate length PTGV and JPTGV for RF applications.

A unipolar-CMOS with recessed source/drain load

In this study, for the first time, we produce a unipolar-CMOS logic, by replacing each of the PMOS devices with a gate-controlled punchthrough NMOS. Such a new logic maintains the traditional advantages of CMOS fabrication while avoiding the need to fabricate large p-well region on chip; this can lead to an improved transistor density, especial in non-Si technologies. To validate the feasibility of this design theory, we use commercial TCAD tools to simulate and verify Unipolar-CMOS inverters, NAND gates, NOR gates, and static random-access memory (SRAM). In each case, the simulation results show that the Unipolar-CMOS logic functions correctly. Moreover, this new logic is scalable to the Deca-Nanometer range, because the gate-controlled punchthrough NMOS is not significantly affected by the short channel effect. Owing to its superior integration-density and fabrication process, the Unipolar-CMOS technology can not only maintain but also go beyond the Moores law.

Electrical Characterization of 10-nm π-Shaped S/D MOSFETs

In this paper, we numerically explore electrical characteristics of a simple device called the π-shaped source/drain (π-S/D) MOS transistor. Some techniques such as Si/SiGe epitaxial growth and selective SiGe etch process are implemented for the fabrication of quasi-SOI devices with an S/D tie. More importantly, a new method presented here for fabricating π-S/D MOSFETs does not require any additional mask step due to self-alignment process being exploited. The isolation technique is carried out only after S/D annealing, resulting in only four extra process steps introduced in this new quasi-SOI technology. According to numerical simulations, the new π-S/D structure has better control on the short-channel and thermal effects compared with the conventional (conv.) π-S/D structure. Despite Miller capacitance sacrifice behaviour owing to the absence of the conv. isolation approach before gate definition, which causes an increase in the body area under the gate, NMOSFET intrinsic delay τ and cutoff frequency f T are within acceptable limits for this new structure.