S. Jagannathan

Neutron- and Proton-Induced Single Event Upsets for D- and DICE-Flip/Flop Designs at a 40 nm Technology Node

Neutron- and proton-induced single-event upset cross sections of D- and DICE-Flip/Flops are analyzed for designs implemented in a 40 nm bulk technology node. Neutron and proton testing of the flip/flops show only a 30%-50% difference between D- and DICE-Flip/Flop error rates and cross sections. Simulations are used to show that charge sharing is the primary cause for the similar failures-in-time (FIT) rates. Such small improvement in the single-event performance of the DICE implementation over standard D-Flip/Flop designs may warrant careful consideration for the use of DICE designs in 40 nm bulk technologies and beyond.

Comparison of Combinational and Sequential Error Rates for a Deep Submicron Process

It has been predicted that upsets due to Single-Event Transients (SETs) in logic circuits will increase significantly with higher operating frequency and technology scaling. For synchronous circuits manufactured at advanced technology nodes, errors due to single-event transients are expected to exceed those due to latch upsets. Experimental results presented in this paper quantify the contribution of logic errors to the total Soft-Error Rate (SER) for test circuits fabricated in a 40 nm bulk CMOS technology. These results can be used to develop guidelines to assist circuit designers adopt effective hardening strategies to reduce the SER, while meeting performance specifications for high speed logic circuits.

Single-Event Performance and Layout Optimization of Flip-Flops in a 28-nm Bulk Technology

Alpha, neutron, and heavy-ion single-event measurements were performed on both high-performance and hardened flip-flop designs in a 28-nm bulk CMOS technology. The experimental results agree very well with simulation predictions and confirm that event error rates can be reduced dramatically using effective layout design.

Independent Measurement of SET Pulse Widths From N-Hits and P-Hits in 65-nm CMOS

A novel circuit design for separating single-event transients due to N-hits and P-hits is described. Measurement results obtained from a 65 nm technology using heavy-ions show different dominant mechanisms for charge collection for P-hits and N-hits. The data collected represent the first such separation of SET pulse widths for 65 nm bulk CMOS technology. For low LET particles, N-hit transients are longer, but for high LET particles, P-hit transients are longer. N-well depth and the parasitic bipolar effect are shown to be the most important parameters affecting transient pulse widths.

Frequency Dependence of Alpha-Particle Induced Soft Error Rates of Flip-Flops in 40-nm CMOS Technology

In this paper, the alpha-particle induced soft error rate of two flip-flops are investigated as a function of operating frequency between 80 MHz and 1.2 GHz. The two flip-flops-an unhardened D flip-flop and a hardened pseudo-DICE flip-flop were designed in a TSMC 40 nm bulk CMOS technology. The error rates of both flip-flops increase with frequency. Analyses show that an internal single-event transient based upset mechanism is responsible for the frequency dependence of the error rates.

Single-Event Tolerant Flip-Flop Design in 40-nm Bulk CMOS Technology

In this paper, the radiation response of a single-event tolerant flip-flop design named the Quatro flip-flop is presented. Circuit level simulations on the flip-flop design show 1) the critical charge of the sensitive nodes to be greater than that of DICE flip-flop, 2) the number of sensitive nodes and the sensitive area to be fewer than that of DICE flip-flop. A test-chip designed and fabricated at the 40-nm bulk CMOS technology node consisting of Quatro, DICE, and standard D- flip-flops was used for heavy-ions, neutrons, and alpha particles exposures. The experimental results demonstrate superior performance of the Quatro flip-flop design over conventional DICE and D-flip-flop designs.

Technology Scaling Comparison of Flip-Flop Heavy-Ion Single-Event Upset Cross Sections

Heavy-ion experimental results from flip-flops in 180-nm to 28-nm bulk technologies are used to quantify single-event upset trends. The results show that as technologies scale, D flip-flop single-event upset cross sections decrease while redundant storage node flip-flops cross sections may stay the same or increase depending on the layout spacing of storage nodes. As technology feature sizes become smaller, D flip-flop single-event upset cross sections approach redundant storage node hardened flip-flops cross sections for particles with high linear energy transfer values. Experimental results show that redundant storage node designs provide > 100X improvement in single-event upset cross section over DFF for ion linear energy transfer values below 10 MeV-cm2/mg down to 28-nm feature sizes.

Performance, Metastability, and Soft-Error Robustness Trade-offs for Flip-Flops in 40 nm CMOS

In modern CMOS processes, soft errors and metastability are two prominent failure mechanisms. Radiation induced single event upsets, or soft-errors, have become a dominant failure mechanism in sub-100 nm CMOS memory and logic circuits. The effects of metastability have also becoming increasingly significant in high-speed applications implemented in nanometric processes. In this paper the design trade-offs for flip-flops between performance, soft-error robustness and metastability are described. Soft-error robust flip-flops are implemented based on both the DICE cell and the Quatro cell. SPICE simulations are used to characterize the transient performance and metastability robustness, and device level simulations were performed to quantify the soft-error robustness. The flip-flops were fabricated in the TSMC 40 nm process and radiation measurements were performed at several test facilities. The Quatro flip-flop showed improved soft-error robustness and metastability when compared with a reference D flip-flop and a DICE flip-flop.

Impact of Supply Voltage and Frequency on the Soft Error Rate of Logic Circuits

Alpha particle irradiations of 28-nm combinational logic and flip-flop circuits under different supply voltage and frequency operating conditions are investigated. Results indicate that while the supply voltage has a strong impact on the alpha particle soft error rate of flip-flops, the combinational logic error rate is relatively unaffected by supply voltage variation. Simulations are used to explain the results and highlight the differences between low-LET alpha particle irradiation and heavy-ion irradiation as far as voltage dependence of the logic soft error rate is concerned. Moreover, frequency has a much stronger impact on the logic soft error rate as compared to the flip-flop soft error rate. As a result, the frequency at which soft errors from combinational logic circuits will exceed errors from flip-flops decreases as the voltage increases. The impact of these observations is discussed in the context of soft-error mitigation strategies.

On-Chip Measurement of Single-Event Transients in a 45 nm Silicon-on-Insulator Technology

Direct observation of fast-transient single event signatures often involves considerable uncertainty due to the limitations of monitoring circuitry. A built-in-self-test circuit for the measurement of single-event transients (SET) has been implemented in a 45 nm partially depleted silicon-on-insulator technology that allows for the extraction of measurement-induced uncertainty. SET pulse width data from heavy-ion experiments are provided and compared to technology computer aided design simulations. A method for compensating for the measurement bias and skew is provided.