Shibesh Dutta

Thickness dependence of the resistivity of platinum-group metal thin films

We report on the thin film resistivity of several platinum-group metals (Ru, Pd, Ir, and Pt). Platinum-group thin films show comparable or lower resistivities than Cu for film thicknesses below about 5u2009nm due to a weaker thickness dependence of the resistivity. Based on experimentally determined mean linear distances between grain boundaries as well as ab initio calculations of the electron mean free path, the data for Ru, Ir, and Cu were modeled within the semiclassical Mayadas–Shatzkes model [Phys. Rev. B 1, 1382 (1970)] to assess the combined contributions of surface and grain boundary scattering to the resistivity. For Ru, the modeling results indicated that surface scattering was strongly dependent on the surrounding material with nearly specular scattering at interfaces with SiO2 or air but with diffuse scattering at interfaces with TaN. The dependence of the thin film resistivity on the mean free path is also discussed within the Mayadas–Shatzkes model in consideration of the experimental findings.

Ruthenium metallization for advanced interconnects

We demonstrate 10 nm half-pitch (HP) Ruthenium interconnects filled by atomic layer deposition (ALD). The resistivity and the cross-sectional area of Ruthenium interconnects were determined via the Matthiessens rule method. We find that the resistivity of Ru was rather independent of the cross-sectional area of the interconnect, increasing from 12 μΩcm for larger lines to 15-17 μΩcm for cross-sectional areas of 200-300 nm2. 10 nm HP Ru lines showed no electromigration failures at 5 MA/cm2 and 300°C during 1000 hours. Time-dependent dielectric breakdown measurements indicated that Ruthenium does not require a diffusion barrier on both dense and porous low-κ dielectrics.

Highly Scaled Ruthenium Interconnects

Ruthenium has emerged as a promising candidate to substitute Cu as the interconnect metallization in future technology nodes. Here, we demonstrate area scaling of Ru wires down to cross-sectional areas of 33 nm² through subtractive patterning by using a metal-spacer patterning technique. The wires were characterized by physical as well as electrical measurements and demonstrate low resistivity, between 20 and <inline-formula> <tex-math notation=LaTeX>

Ruthenium interconnects with 58 nm 2 cross-section area using a metal-spacer process

35~mu Omega

Resistivity scaling model for metals with conduction band anisotropy

</tex-math></inline-formula>cm for cross-sectional areas between 175 and 33 nm².

Effects of substrate heating and post-deposition annealing on characteristics of thin MOCVD HfO2 films

Platinum-group metals have emerged as promising alternatives to replace Cu in scaled interconnects. Here, we present a short-loop test vehicle to fabricate metal nanowires with sub-100 nm2 cross-section area without the need for multiple patterning or CMP. Ru nanowires with 58 nm2 cross-section area, as determined by the TCR method, were realized and characterized by transmission electron microscopy and electrical measurements. The nanowires demonstrate low resistivity (27 µΩcm) and very high current carrying capacity with fusing currents as high as 720 MA/cm2.

Hall effect measurement for precise sheet resistance and thickness evaluation of Ruthenium thin films using non-equidistant four-point probes

It is generally understood that the resistivity of metal thin films scales with film thickness mainly due to grain boundary and boundary surface scattering. Recently, several experiments and ab initio simulations have demonstrated the impact of crystal orientation on resistivity scaling. The crystal orientation cannot be captured by the commonly used resistivity scaling models and a qualitative understanding of its impact is currently lacking. In this work, we derive a resistivity scaling model that captures grain boundary and boundary surface scattering as well as the anisotropy of the band structure. The model is applied to Cu and Ru thin films, whose conduction bands are (quasi-)isotropic and anisotropic respectively. After calibrating the anisotropy with ab initio simulations, the resistivity scaling models are compared to experimental resistivity data and a renormalization of the fitted grain boundary reflection coefficient can be identified for textured Ru.

N5 technology node dual-damascene interconnects enabled using multi patterning

It is well known that Hf-based dielectrics have replaced the traditional SiO2 and SiON as gate dielectric materials for conventional CMOS devices. By using thicker high-k materials such as HfO2 rather than ultra-thin SiO2, we can bring down leakage current densities in MOS devices to acceptable levels. HfO2 is also one of the potential candidates as a blocking dielectric for Flash memory applications for the same reason. In this study, effects of substrate heating and oxygen flow rate while depositing HfO2 thin films using CVD and effects of post deposition annealing on the physical and electrical characteristics of HfO2 thin films are presented. It was observed that substrate heating during deposition helps improve the density and electrical characteristics of the films. At higher substrate temperature, Vfb moved closer to zero and also resulted in significant reduction in hysteresis. Higher O2 flow rates may improve capacitance, but also results in slightly higher leakage. The effect of PDA depended on film thickness and O2 PDA improved characteristics only for thick films. For thinner films forming gas anneal resulted in better electrical characteristics.

Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties

We present a new micro Hall effect measurement method using non-equidistant electrodes. We show theoretically and verify experimentally that it is advantageous to use non-equidistant electrodes for samples with low Hall sheet resistance. We demonstrate the new method by experiments where Hall sheet carrier densities and Hall mobilities of Ruthenium thin films (3-30 nm) are determined. The measurements show that it is possible to measure Hall mobilities as low as 1 cm2V−1s−1 with a relative standard deviation of 2-3%. We show a linear relation between measured Hall sheet carrier density and film thickness. Thus, the method can be used to monitor thickness variations of ultra-thin metal films.We present a new micro Hall effect measurement method using non-equidistant electrodes. We show theoretically and verify experimentally that it is advantageous to use non-equidistant electrodes for samples with low Hall sheet resistance. We demonstrate the new method by experiments where Hall sheet carrier densities and Hall mobilities of Ruthenium thin films (3-30 nm) are determined. The measurements show that it is possible to measure Hall mobilities as low as 1 cm2V−1s−1 with a relative standard deviation of 2-3%. We show a linear relation between measured Hall sheet carrier density and film thickness. Thus, the method can be used to monitor thickness variations of ultra-thin metal films.

Characterization of ultra-thin nickel-silicide films synthesized using the solid state reaction of Ni with an underlying Si

We demonstrate an integration approach to enable 16nm half-pitch interconnects suitable for the 5nm technology node using 193i Lithography, SADP, SAQP, three times Litho-Etch (LE3) and tone-inversion. A silicon-verified DOE experiment on a SAQP process suggests a tight process window for core etch and spacer depositions. We also show a novel process flow which enable us to pattern tight-pitch metal-cut (block), and effectively scale the trench CD to 12nm at pitch 32nm. Finally we discuss line resistance and resistivity obtained for the 16nm and 12nm trenches created using 193i integration flow.