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Dive into the research topics where Tomonori Okudaira is active.

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Featured researches published by Tomonori Okudaira.


international electron devices meeting | 1990

A novel source-to-drain nonuniformly doped channel (NUDC) MOSFET for high current drivability and threshold voltage controllability

Yoshinori Okumura; Masayoshi Shirahata; Tomonori Okudaira; Atsushi Hachisuka; Hideaki Arima; Takayuki Matsukawa; N. Tsubouchi

A novel source-to-drain nonuniformly doped channel (NUDC) MOSFET was investigated theoretically and experimentally. Using an analytical model, it is verified that the mobility of the NUDC MOSFET is increased as compared with that of the conventional channel MOSFET. Also, the V/sub th/ lowering of the NUDC MOSFET is suppressed as compared with that of the conventional channel MOSFET. The NUDC MOSFET was fabricated by the oblique rotating ion implantation technique, and the theoretical predictions were confirmed experimentally.<<ETX>>


international electron devices meeting | 1990

A novel stacked capacitor cell with dual cell plate for 64 Mb DRAMs

Hideaki Arima; Atsushi Hachisuka; T. Ogawa; Tomonori Okudaira; Yoshinori Okumura; Kaoru Motonami; Takayuki Matsukawa; N. Tsubouchi

The authors propose a novel stacked capacitor cell with dual cell plate (DCP cell) for 64-Mb DRAMs. The major advantage of this cell is that the dual cell plates completely surround the whole surface of the storage polysilicon, and the storage capacitance of this cell increases significantly compared to the conventional stacked capacitor cell. For a 1.3- mu m/sup 2/ cell, the DCP cell should achieve a storage capacitance of more than 25 fF. The experimental results indicate that the DCP cell can realize the 64-Mb DRAMs and 1.3- mu m/sup 2/ cell area using the 0.3- mu m design rule.<<ETX>>


international electron devices meeting | 1998

A manufacturable integration technology of sputter-BST capacitor with a newly proposed thick Pt electrode

Yoshikazu Tsunemine; Tomonori Okudaira; Keiichiro Kashihara; K. Hanafusa; A. Yutani; Y. Fujita; M. Matsushita; H. Itoh; H. Miyoshi

A novel process technology to realize a thick Pt bottom electrode is developed, particularly for facilitating the use of sputter-BST capacitors. The sputter-BST capacitor fabricated with this technology gives a production-worthy yield and maintains initial electrical properties after finishing the back-end process, including the Al wiring and the plasma SiN-passivation. By using this technology, it is feasible to obtain a reliable BST capacitor in the 0.16 /spl mu/m-geometry, with the achievement of BSTs Teq, SiO/sub 2/-equivalent thickness, of 0.40 nm and a 300 nm-high bottom electrode.


Archive | 1995

Electronic device using zirconate titanate and barium titanate ferroelectrics in insulating layer

Keiichiro Kashihara; Tomonori Okudaira; Hiromi Itoh


Archive | 1995

Apparatus for forming thin film by chemical vapor deposition

Akimasa Yuuki; Takaaki Kawahara; Tetsuro Makita; Mikio Yamamuka; Koichi Ono; Tomonori Okudaira


Archive | 1994

Semiconductor device with high dielectric capacitor having sidewall spacers

Tomonori Okudaira; Takeharu Kuroiwa; Nobuo Fujiwara; Keiichiro Kashihara


Archive | 1994

Semiconductor device having a capacitor with an adhesion layer

Tomonori Okudaira; Takeharu Kuroiwa


Archive | 1994

Semiconductor device high dielectric capacitor with narrow contact hole

Tomonori Okudaira; Keiichiro Kashihara


Archive | 1993

Field effect transistor having impurity regions of different depths and manufacturing method thereof

Hideaki Arima; Makoto Ohi; Natsuo Ajika; Atsushi Hachisuka; Tomonori Okudaira


Archive | 1991

Element isolating structure of semiconductor device suitable for high density integration

Masao Nagatomo; Hiroki Shimano; Tomonori Okudaira; Yoshinori Okumura

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