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Viraj Y. Sardesai

IBM

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Publication

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Archive | 2012

SILICIDE CONTACTS HAVING DIFFERENT SHAPES ON REGIONS OF A SEMICONDUCTOR DEVICE

Emre Alptekin; Dong-Ick Lee; Viraj Y. Sardesai; Cung D. Tran; Jian Yu; Reinaldo A. Vega; Rajasekhar Venigalla

Archive | 1998

Semiconductor wafer edge bead removal method and tool

Bradley P. Jones; Viraj Y. Sardesai

Archive | 2000

Variable stoichiometry silicon nitride barrier films for tunable etch selectivity and enhanced hyrogen permeability

Rajarao Jammy; Johnathan E. Faltermeier; Keitaro Imai; Ryota Katsumata; Jean-Marc Rousseau; Viraj Y. Sardesai; Joseph F. Shepard

Archive | 2000

Fully encapsulated damascene gates for Gigabit DRAMs

Ramachandra Divakaruni; Jeffrey P. Gambino; Jack A. Mandelman; Viraj Y. Sardesai; Mary E. Weybright

Archive | 2014

FORMATION OF AIR-GAP SPACER IN TRANSISTOR

Emre Alptekin; Viraj Y. Sardesai; Cung D. Tran; Reinaldo A. Vega

Archive | 2011

METHOD OF FORMING SILICIDE CONTACTS OF DIFFERENT SHAPES SELECTIVELY ON REGIONS OF A SEMICONDUCTOR DEVICE

Emre Alptekin; Dong-Ick Lee; Viraj Y. Sardesai; Cung D. Tran; Jian Yu; Reinaldo A. Vega; Rajasekhar Venigalla

Archive | 2012

LOCAL INTERCONNECTS COMPATIBLE WITH REPLACEMENT GATE STRUCTURES

Viraj Y. Sardesai

Archive | 2014

FinFET device formation

Emre Alptekin; Viraj Y. Sardesai; Reinaldo A. Vega

Archive | 2012

Method of Manufacturing Dummy Gates of a Different Material as Insulation between Adjacent Devices

Emre Alptekin; Gregory A. Northrop; Viraj Y. Sardesai; Cung D. Tran

Archive | 2003

Dram buried strap process with silicon carbide

David M. Dobuzinsky; Jonathan Faltermeier; Philip L. Flaitz; Rajarao Jammy; Yuko Lisa Ninomiya; Viraj Y. Sardesai; Yun Y. Wang

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Emre Alptekin

IBM

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Cung D. Tran

IBM

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Reinaldo A. Vega

IBM

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Ahmet S. Ozcan

IBM

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Rajasekhar Venigalla

IBM

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David M. Dobuzinsky

IBM

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Johnathan E. Faltermeier

IBM

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Philip L. Flaitz

IBM

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Ramachandra Divakaruni

IBM

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Sameer H. Jain

IBM

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