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Dive into the research topics where Wilbur C. Krusell is active.

Publication


Featured researches published by Wilbur C. Krusell.


MRS Proceedings | 1997

Chemical Mechanical Cleaning for Post-CMP Applications: Defects and Metals Results

E. Zhao; R. Emami; I. Malik; K. Mishra; Wilbur C. Krusell; J. de Larios; Diane J. Hymes

Double-sided brush scrubbing has become a dominant method for post-CMP cleaning applications. Chemicals delivered in-situ with brush scrubbing greatly enhance the cleaning capabilities. In this paper, the effect of dilute HF on reducing particulate defects and trace metal contamination on polished oxide surface is studied using a HF-compatible double-sided scrubber. AFM data on the interaction of dilute HF with oxide / tungsten plug array after tungsten CMP is also presented. Scrubbing with dilute HF is shown to be highly effective is removing slurry agglomerates that strongly adhere to the post-CMP oxide film.


Archive | 2000

Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing

Jiri Pecen; Saket Chadda; Rahul Jairath; Wilbur C. Krusell


Archive | 1998

Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing

Jiri Pecen; John Fielden; Saket Chadda; Lloyd J. Lacomb; Rahul Jairath; Wilbur C. Krusell


Archive | 1997

Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher

Rahul Jairath; Jiri Pecen; Saket Chadda; Wilbur C. Krusell; Jerauld J. Cutini; Erik H. Engdahl


Archive | 2000

Capillary proximity heads for single wafer cleaning and drying

John M. de Larios; Mike Ravkin; Glen Travis; Jim Keller; Wilbur C. Krusell


Archive | 2002

Methods for wafer proximity cleaning and drying

John M. de Larios; Mike Ravkin; Glen Travis; Jim Keller; Wilbur C. Krusell


Archive | 1999

Methods and apparatus for cleaning semiconductor substrates after polishing of copper film

Liming Zhang; Yuexing Zhao; Diane J. Hymes; Wilbur C. Krusell


Archive | 1992

Organic preclean for improving vapor phase wafer etch uniformity

Michael A. Mcneilly; John M. Delarios; Glenn L. Nobinger; Wilbur C. Krusell; Dah-Bin Kao; Ralph K. Manriquez; Chiko Fan


Archive | 2000

Single wafer residue, thin film removal and clean

Wilbur C. Krusell; John M. de Larios; Mike Ravkin


Archive | 1998

Integrated pad and belt for chemical mechanical polishing

Anil K. Pant; Rahul Jairath; Kamal Mishra; Saket Chadda; Wilbur C. Krusell

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Edward T. Ferri

MITSUBISHI MATERIALS CORPORATION

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