Bruce E. White

Fermi-level pinning at the polysilicon/metal-oxide interface-Part II

We report here that Fermi pinning at the polysilicon/metal-oxide interface causes high threshold voltages in MOSFET devices. In Part I, we investigated the different gatestack regions and determined that the polysilicon/metal oxide interface plays a key role on the threshold voltages. Now in Part II, the effects of the interfacial bonding are examined by experiments with submonolayer atomic-layer deposition (ALD) metal oxides and atomistic simulation. Results indicate that pinning occurs due to the interfacial Si-Hf and Si-O-Al bonds for HfO/sub 2/ and Al/sub 2/O/sub 3/, respectively. Oxygen vacancies at polysilicon/HfO/sub 2/ interfaces also lead to Fermi pinning. This fundamental characteristic affects the observed polysilicon depletion.

Contributions to the effective work function of platinum on hafnium dioxide

The intrinsic and extrinsic contributions to Fermi level pinning of platinum (Pt) electrodes on hafnium dioxide (HfO2) gate dielectrics are investigated by examining the impact of oxygen and forming gas anneals on the effective work function of Pt-HfO2-silicon capacitors. The effective platinum work function is ∼4.6eV when annealed in forming gas. However, diffusion of oxygen to the Pt∕HfO2 interface increases the platinum work function to a value of ∼4.9eV. Subsequent annealing in forming gas returns the platinum work function to a value comparable to that measured prior to the oxygen anneal. The effective platinum work functions are compared to the prediction of the metal induced gap states (MIGS) model. The presence of interfacial oxygen vacancies or platinum–hafnium bonds is believed to be responsible for a degree of pinning that is stronger than predicted from the MIGS model alone.

Fermi level pinning at the polySi/metal oxide interface

We report here for the first time that Fermi pinning at the polySi/metal oxide interface causes high threshold voltages in MOSFET devices. Results indicate that pinning occurs due to the interfacial Si-Hf and Si-O-Al bonds for HfO/sub 2/ and Al/sub 2/O/sub 3/, respectively. This fundamental characteristic also affects the observed polySi depletion. Device data and simulation results will be presented.

Impact of Deposition and Annealing Temperature on Material and Electrical Characteristics of ALD HfO2

Hafnium oxide (HfO 2 ) is one of the most promising high-k materials to replace SiO 2 as a gate dielectric. Here we report material and electrical characterization of atomic layer deposition (ALD) hafnium oxide and the correlations between the results. The HfO2 films were deposited at 200, 300, or 370°C and annealed in a nitrogen ambient at 550, 800, and 900°C. Results indicate that deposition temperature controls both the material and the electrical properties. Materials and electrical properties of films deposited at 200°C are most affected by annealing conditions compared to films deposited at higher temperatures. These films are amorphous as deposited and become polycrystalline after 800°C anneals. Voids are observed after a 900°C anneal for the 200°C deposited films. The 200°C deposited films have charge trapping and high leakage current following anneals at 900°C. The 300°C deposited films have lower chlorine content and remain void-free following high-temperature anneals. These films show a thickness-dependent crystal structure. Annealing the films reduces leakage current by four orders of magnitude. Finally, films deposited at 370°C have the highest density, contain the least amount of impurities, and contain more of the monoclinic phase of HfO 2 than those deposited at 300 and 200°C. The best electrical performance was obtained for films deposited at 370°C.

Hafnium zirconate gate dielectric for advanced gate stack applications

We report on the development of a hafnium zirconate (HfZrO4) alloy gate dielectric for advanced gate stack applications. The HfZrO4 and hafnium dioxide (HfO2) films were formed by atomic layer deposition using metal halides and heavy water as precursors. The HfZrO4 material properties were examined and compared with those of HfO2 by a wide variety of analytical methods. The dielectric properties, device performance, and reliability of HfZrO4 were investigated by fabricating HfZrO4/tantalum carbide (TaxCy) metal-oxide-semiconductor field effect transistor. The HfZrO4 dielectric film has smaller band gap, smaller and more uniform grains, less charge traps, and more uniform film quality than HfO2. The HfZrO4 dielectric films exhibited good thermal stability with silicon. Compared to HfO2, the HfZrO4 gate dielectric showed lower capacitance equivalent thickness value, higher transconductance, less charge trapping, higher drive current, lower threshold voltage (Vt), reduced capacitance-voltage (C-V) hysteresis...

Impact of Zr addition on properties of atomic layer deposited HfO2

The impact of Zr addition on microstructure of HfO2 after high temperature processing was investigated using Rutherford backscattering, x-ray diffraction (XRD), transmission electron microscopy, and atomic force microscopy (AFM). The ZrO2 content in the films was varied from ∼25% to 75%. XRD analysis shows that adding >50% ZrO2 leads to partial stabilization of tetragonal phase of the HfxZr1−xO2 alloy. AFM images revealed smaller grains with Zr addition. Conducting AFM showed more uniform and tighter tunneling current distribution in HfxZr1−xO2 compared to HfO2. Constant capacitance-voltage stressing performed on HfO2 and HfxZr1−xO2 metal-oxide-semiconductor capacitors indicated reduced charge trapping with Zr addition.

Impact of titanium addition on film characteristics of HfO2 gate dielectrics deposited by atomic layer deposition

The impact of 8-to45-at.% Ti on physical and electrical characteristics of atomic-layer-deposited and annealed hafnium dioxide was studied using vacuum-ultraviolet spectroscopic ellipsometry, secondary ion mass spectroscopy, transmission electron microscopy, atomic force microscopy, x-ray diffraction, Rutherford backscattering spectroscopy, x-ray photoelectron spectroscopy, and x-ray reflectometry. The role of Ti addition on the electrical performance is investigated using molybdenum (Mo)-gated capacitors. The film density decreases with increasing Ti addition. Ti addition stabilizes the amorphous phase of HfO2, resulting in amorphous films as deposited. After a high-temperature annealing, the films transition from an amorphous to a polycrystalline phase. Orthorhombic Hf–Ti–O peaks are detected in polycrystalline films containing 33-at.% or higher Ti content. As Ti content is decreased, monoclinic HfO2 becomes the predominant microstructure. No TiSi is formed at the dielectric/Si interface, indicating fil...

Tantalum carbonitride electrodes and the impact of interface chemistry on device characteristics

The intent of this research is to understand the role of interface chemistry on the effective work function and device characteristics of metal gate electrodes on hafnium dioxide (HfO2) gate dielectrics in metal oxide semiconductor field effect transistors. Since multiple factors, including crystal structure, preferred orientation, chemical composition, interface bonding, and reactions or interdiffusions, impact the effective work function, solid-solution carbonitrides of tantalum (TaCxN1−x) have been studied in an attempt to isolate the role of interface chemistry on the effective work function. Tantalum carbonitride films have been carefully deposited with similar Ta∕(C+N) ratios to understand how the substitution of N for C on the octahedral interstice in a face-centered-cubic tantalum lattice impacts device performance. Results indicate that the effective work function and device threshold voltage are reduced when the less electronegative carbon atom is substituted for the more electronegative nitroge...

Physical and Electrical Characteristics of HfO2 Gate Dielectrics Deposited by ALD and MOCVD

Film characteristics of HfO 2 gate dielectrics formed on Si(100) by atomic layer deposition (ALD) or metallorganic chemical vapor deposition (MOCVD) were investigated by atomic force microscopy, transmission electron microscopy, secondary ion mass spectroscopy (SIMS), X-ray reflectometry, ellipsometry, and electrical measurements. HfCl 4 and water were the precursors used for ALD HfO 2 deposition at 300 and 370°C, whereas C 1 6 H 3 6 HfO 4 was used for MOCVD deposition at 550 and 650°C. Film thickness increases linearly with time for both deposition techniques. The ALD and MOCVD films have comparable density. MOCVD thin films are polycrystalline, while the 300°C deposited ALD HfO 2 are amorphous. The 370°C deposited ALD HfO 2 are polycrystalline. SIMS analysis indicated chlorine and carbon are the major contaminants in ALD and MOCVD HfO 2 films, respectively. Electrical properties of ALD and MOCVD HfO 2 films were examined using metal oxide silicon capacitors. Well-behaved capacitance-voltage and leakage current-voltage characteristics were obtained for both types of films. ALD films have slightly higher capacitance and comparable leakage when compared to MOCVD films. Room temperature and 105°C stressing of the capacitance-voltage curves showed a significant shift in the capacitance-voltage curve indicating that charge trapping was observed for all films with the 650°C deposited MOCVD showing the largest capacitance-voltage shift. Unlike MOCVD films, the capacitance-voltage characteristics of ALD films remain well behaved after stressing.

Impact of film properties of atomic layer deposited HfO2 resulting from annealing with a TiN capping layer

Atomic layer deposited HfO2 films void and exhibit poor electrical characteristics when annealed at high temperature unless a TiN capping layer is used. The TiN is removed prior to characterization of the dielectric. The authors find that capped HfO2 films annealed at 1000°C by rapid thermal process are smooth and void-free. The microstructure of HfO2 is modified from fully monoclinic to a mixed monoclinic and tetragonal phase when the capping layer is used. Conducting atomic force microscopy performed on these films shows fewer areas with high leakage current. Mo∕HfO2 capacitors show improved CV characteristics and lower leakage current density.